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ChipMOS SHAREHOLDERS APPROVE CASH DIVIDEND DISTRIBUTION OF NT$1.80 PER COMMON SHARE OR APPROXIMATELY US$1.11 PER ADS

Published : Wednesday, June 12, 2024, 9:10 pm
ACROFAN=PRNasia | hkcs@prnasia.com | SNS

HSINCHU, June 12, 2024 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and Nasdaq: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"), announced shareholders approved a cash dividend distribution from earnings of NT$1.80 per common share or approximately US$1.11 per ADS. The dividend, which the Company's Board previously declared on February 22, 2024, was approved by shareholders at the Company's AGM on May 30, 2024. The Company has submitted a dividend/distribution form to Nasdaq, as notification of the below actions for the Company's American Depositary Shares ("ADRs").

  • Type of Distribution: Cash Dividend
  • Declaration Date: June 11, 2024
  • Ex-Dividend Date: June 27, 2024
  • ADR Dividend Record Date: June 27, 2024
  • ADR Dividend Distribution Date: July 26, 2024
  • ADR books will be closed from June 27 to July 5, 2024
  • The final dividend amount to be distributed in U.S. dollars will be determined by the Depositary, Citibank, N.A., once it receives the distribution from the Company, which is expected to be on July 19, 2024, converts the amount from New Taiwan Dollars into U.S. Dollars and deducts appropriate taxes and fees.

Any questions regarding the dividend distribution should be directed to Citibank, N.A.'s Tiffany Ma (Tel: +1-973-461-5734 or tiffany.ma@citi.com).

About ChipMOS TECHNOLOGIES INC.:
ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and Nasdaq: IMOS) (www.chipmos.com) is an industry leading provider of outsourced semiconductor assembly and test services. With advanced facilities in Hsinchu Science Park, Hsinchu Industrial Park and Southern Taiwan Science Park in Taiwan, ChipMOS is known for its track record of excellence and history of innovation. The Company provides end-to-end assembly and test services to leading fabless semiconductor companies, integrated device manufacturers and independent semiconductor foundries serving virtually all end markets worldwide. 

Forward-Looking Statements 
This press release may contain certain forward-looking statements. These forward-looking statements may be identified by words such as 'believes,' 'expects,' 'anticipates,' 'projects,' 'intends,' 'should,' 'seeks,' 'estimates,' 'future' or similar expressions or by discussion of, among other things, strategies, goals, plans or intentions. These statements may include financial projections and estimates and their underlying assumptions, statements regarding plans, objectives and expectations with respect to future operations, products and services, and statements regarding future performance. Actual results may differ materially in the future from those reflected in forward-looking statements contained in this document, due to various factors. Further information regarding these risks, uncertainties and other factors are included in the Company's most recent Annual Report on Form 20-F filed with the U.S. Securities and Exchange Commission (the "SEC") and in the Company's other filings with the SEC.

 

Contacts:

In Taiwan 

Jesse Huang

ChipMOS TECHNOLOGIES INC.

+886-6-5052388 ext. 7715

IR@chipmos.com

 

In the U.S.

David Pasquale

Global IR Partners

+1-914-337-8801

dpasquale@globalirpartners.com

 



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